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Due to a lack of customers, the opening of Samsung’s Taylor wafer fab in the United States has been postponed to 2026
2025-07-07
According to Nikkei Asia, Samsung’s cutting-edge process wafer fab in Taylor, Texas, USA, although nearing completion, has been postponed until 2026 due to a lack of customers. According to reports, an internal document from Samsung in March this year showed that the completion rate of the Taylor wafer fab had already reached 91.8%. However, Samsung Taylor’s wafer fab has not yet received customer orders, as the demand for chips from domestic customers in the United States seems to be more inclined towards advanced process technologies at 4nm and above.
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Maoze launches Infineon PSOC Control C3 MCU for next-generation motor control applications
2025-07-03
Mouser Electronics, a global authorized agent for introducing new electronic components and industrial automation products, is now selling Infineon’s PSOC ™ Control C3 microcontroller (MCU). PSOC
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The 1.3kW fully digital, configurable, modular AC-DC power supply series defines new standards in power density and onboard intelligence
2025-06-26
XP Power has launched the FLXPro series, completely changing the market for configurable modular power supplies. FLX1K3 is a 1.3kW configurable board mounted AC-DC power supply designed to simplify power systems for healthcare, industrial applications, semiconductor manufacturing, analytical instruments, automation, renewable energy systems, and robots.
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Kaixia launches PCIe 5.0 data center grade solid-state drive CD9P, based on BiCS 8 TLC NAND flash memory
2025-06-23
Kaixia announced yesterday local time in the United States the launch of a new generation PCIe 5.0 data center grade solid-state drive CD9P based on the eighth generation BiCS 3D TLC NAND flash memory. This series of products is designed specifically for GPU accelerated AI servers that require high throughput, low latency, and high consistency.
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