TDK has recently launched the ADL4524VL series of car mounted PoC winding inductors, which achieve breakthrough high impedance characteristics of 10MHz-1GHz ultra wideband and military grade temperature tolerance of -55 ℃~155 ℃. The 4.5 × 2.4 × 2.6mm ultra-thin package replaces the traditional three inductance scheme with a single device, saving 40% of PCB area for ADAS camera systems and helping smart cars achieve lightweight wiring and energy efficiency upgrades.

TDK Corporation (TSE: 6762) is proud to announce the launch of its new B3264xH series of double-sided metallized metallized polypropylene (MMKP) film capacitors. This new series of components is specifically designed to handle pulse stresses of up to 6,500 V/µs in high-frequency applications, effectively addressing the limitations of traditional solutions

According to the Korean Economic Daily (Hankyung), Samsung is preparing to invest an additional $7 billion in the United States to establish an advanced semiconductor packaging factory after reaching a $16.5 billion chip foundry contract with Tesla.

Shanghai, China - July 28, 2025- Onsemi (NASDAQ: ON) announced the expansion of its partnership with leading drive technology company Schaeffler, adopting Onsemi’s next-generation silicon carbide MOSFET EliteSiC product line in a new design bid project. Anson’s solution will be integrated into Schaeffler’s main drive inverter for an advanced plug-in hybrid electric vehicle (PHEV) platform from a leading global automaker.