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Infineon launches a new 600 V CoolMOS S7TA MOSFET with integrated high-precision temperature sensors
2024-06-25
Infineon Technologies, a global semiconductor leader in power systems and the Internet of Things, recently launched a 600 V CoolMOS suitable for automotive power management applications ™ S7TA super junction MOSFET. S7TA is designed specifically to meet the special requirements of automotive electronic components, and its integrated temperature sensor is used in industrial applications of similar products (CoolMOS) ™ On the basis of the progress made by S7T, the accuracy of junction temperature sensing has been significantly improved, thus possessing advantages such as higher durability, safety, and efficiency that are crucial for the automotive industry.
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XP Power launches a compact 550W AC-DC power supply, providing natural convection, conduction, and fan cooling levels for medical (BF) and industrial
2024-06-20
XP Power officially announced the launch of a new compact 550W AC-DC power supply, which can be used for natural convection cooling, conduction cooling, and forced air cooling. This new PSU can meet medical and industrial applications, suitable for a wide range of applications - including sealed housing environments.
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Melexis drives industry transformation: achieving ultra miniaturization of automotive lighting LED driver chips
2024-06-17
Melexis, a global microelectronics engineering company, recently announced that as a leader in the field of automotive dynamic lighting LED driver chips, it has officially launched its new product MLX81123, further expanding its LIN RGB series product line. This chip is deeply optimized based on the previous generation products, with a more compact packaging design and significantly improved cost-effectiveness, while maintaining stable and reliable excellent performance. In addition, by laying out new supply chains, Mailaixin not only significantly enhances industry competitiveness, but also ensures customer business continuity.
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Infineon launches a new industrial CoolSiC MOSFET 650 V G2 with TOLT and Thin-TOLL packaging, improving system power density
2024-06-14
Driven by technological progress and increasing attention to low-carbon, the electronics industry is transitioning towards more compact and powerful systems. Infineon Technologies Inc. is actively supporting and accelerating this trend with the launch of Thin-TOLL 8x8 and TOLT packaging. These products can make greater use of PCB motherboards and daughter cards, while also taking into account the cooling requirements and space limitations of the system. Currently, Infineon is expanding its CoolSiC by adopting two new product lines, Thin-TOLL 8x8 and TOLT packaging ™ MOSFET discrete semiconductor device 650 V product portfolio.
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