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RECOM launches medical grade, wide input DC/DC converter with 2MOPP/250 VAC for the first time
2024-10-07
RECOM has launched two cost-effective DC/DC converters with the highest level of medical isolation, using both through-hole installation and SMD types. The REM2A and REM4A series are 2 W and 4 W respectively, with reinforced insulation of 5 kVAC/1 min and dual patient protection at 250 VAC. These products are suitable for (2MOPP) function and have a creepage distance and electrical clearance of over 8 mm. B. For BF and CF type patient contact applications, the leakage current is as low as 2 µ A.
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Dior launches Hall effect chips that meet automotive specifications, offering multiple switch sensitivity options for optimal proximity sensing
2024-09-24
Dior (Nasdaq: DIOD) announced the addition of two enhanced high-voltage Hall effect switch chip series to its automotive specification * product portfolio. The unipolar AH332xQ and all polar AH352xQ are packaged in SIP-3, SOT23 (S-type), and SC59, providing multiple sensitivity options for operation. These two devices can be widely used in non-contact position and proximity detection product applications, such as seat belt fastening, door/rear compartment opening and closing, wipers, and steering wheel locks.
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TDK launches multiple PoDL expansion boards for SPE evaluation of analog components
2024-09-18
TDK Corporation (Tokyo Stock Exchange code: 6762) announced the launch of a series of 10BASE-T1L plug and play test boards, known as EVB-DLA-00x. These test boards have six power levels to choose from, suitable for single pair Ethernet (SPE) evaluation boards for analog components (ADI) EVAL-ADIN1100EBZ and EVAL-ADIN1110EBZ. SPE technology can provide seamless Ethernet connectivity from a single sensor to the cloud, making the creation of Industrial Internet of Things (IIoT) and Industry 4.0 networks easier.
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NRF9151 is officially mass-produced and launched! Small, low-power cellular interconnect solutions empower large-scale IoT market applications
2024-09-09
Nordic Semiconductor, a leading global provider of low-power wireless IoT connectivity solutions, announced the launch of its small, low-power system in package (SiP) product nRF9151 and its accompanying nRF9151 development kit (DK).
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