Artificial intelligence workloads are redefining the power demand of modern data centers. The soaring GPU power levels and denser rack configurations are pushing server power infrastructure to its limits. To address these challenges, Infineon Technologies (FSE code: IFX/OTCQX code: IFNNY) has launched two system level solutions for server ODM and OEM manufacturers: one is an 18 kW three-phase power module (PSU) reference design optimized for a 50 V rack architecture; The other is a 30 kW three-phase interleaved T-shaped PFC evaluation board designed specifically for rack architecture of 800 VDC or ± 400 VDC power sidecars.

Recently, Vishay Intertechnology, Inc. (NYSE stock code: VSH) announced the launch of six new surface mount polymer positive temperature coefficient (PTC) thermistor series, further expanding its overcurrent protection product line. This series of devices is designed specifically for computer, industrial, and consumer applications, aiming to save circuit board space and improve efficiency.

Dior (Nasdaq: DIOD) announced the launch of APK43070Q, a highly integrated, automotive standard synchronous buck controller with integrated USB Type-C ® PD3.1 source controller.

The newly launched i.MX 937 application processor by NXP can solve this dilemma. This intelligent and cost-effective solution is specifically designed for scalability in automotive, industrial, and IoT edge deployments. This device uses a quad core Arm ® Cortex ® A55 complex, integrated with dedicated NXP eIQ ® The Neutron Neural Processor (NPU) is pin compatible with the i.MX 95 and i.MX 952 series, helping you transform grand concepts into responsive, safe, cost optimized, and energy-efficient edge products.