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SynSense releases a new generation of ultra-low power, high-throughput invasive brain computer interface chip
2026-01-19
SynSense and the Zurich Institute of Neuroinformatics (INI) have officially released a new generation of ultra-low power, high-throughput invasive brain computer interface chip solution. This solution adopts a globally unique event driven neural morphology architecture, which overcomes the energy efficiency problem of high-density neural signal acquisition and real-time processing. Compared with existing solutions such as Neuralink and Intan, the energy efficiency is improved by 10-100 times, providing a mass-produced and highly reliable hardware foundation for long-term implantable brain computer interface systems.
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Allegro expands its Power Thru gate driver product line to simplify silicon carbide (SiC) power supply design for AI data centers and electric vehicle
2026-01-15
The new AHV85003/AHV85043 chipset and flagship product AHV85311 integrated solution together form the industry’s first complete series of noise resistant and self powered SiC gate driver products.
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贸泽电子开售Molex PowerWize 3.40mm互连器件 支持现代化大功率应用提升电源效率
2026-01-12
Mouser Electronics, a global authorized agent for introducing new electronic components and industrial automation products, has launched the sale of Molex’s PowerWize 3.40mm interconnect device. The PowerWize connector uses advanced COEUR socket technology, which can fully improve power efficiency and effectively control costs. PowerWize 3.40mm interconnect devices can meet the needs of modern high-power industrial automation, telecommunications, and network applications, including robots, factory equipment, data storage units, servers, and enterprise switches.
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Kioxia Launches Next-Generation KIOXIA BG7 Series SSD for PC OEMs
2026-01-08
Kioxia Corporation officially released the KIOXIA BG7 series solid state drives (SSDs) today. This product is the industry’s first consumer grade solution for integrating the latest BiCS FLASHTM eighth generation 3D flash memory from an integrated company, utilizing innovative CMOS direct bonding to array (CBA) technology.
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