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英飞凌发布新款MEMS麦克风:71.5 dB信噪比与IP57防护重塑音频体验
2025-10-20
Infineon Technologies recently expands its XENSIV ™ The MEMS microphone product line has launched two digital PDM microphones, IM72D128V and IM69D129F. The new product is based on Infineon’s Sealed Double Diaphragm (SDM) technology, achieving IP57 level dust and water resistance while balancing high sound quality, low power consumption, and strong robustness. Among them, the IM72D128V has a signal-to-noise ratio of up to 71.5 dB (A), specially designed for precise pickup in low-noise environments; The IM69D129F, with its ultra compact size of 3.5 × 2.65 × 0.98 mm ³, is suitable for portable devices with extremely limited space. Both achieve digital signal output through low-noise preamplifiers and Sigma Delta ADCs, providing reliable audio solutions for consumer electronics, industrial monitoring, and vehicle systems.
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Diodes’ low-power I2C/SPI bus to dual-channel UART bridge enhances automotive connectivity robustness
2025-10-16
Dior (Nasdaq: DIOD) announced the launch of PI7C9X762Q, a high-performance I2C/SPI bus to dual channel UART bridge that meets automotive standards. This device has low power consumption in both working and sleep modes, making it very suitable for electric vehicle (EV) design. The main application areas include intelligent cockpits, central controllers, I/O module controllers, advanced driver assistance systems (ADAS), remote information processing, and regional gateways.
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Infineon’s CoolGaN Technology Enhances Power Performance of PoE Ethernet Power Sourcing Equipment in Ronglong Technology Applications
2025-10-13
Infineon Technologies (FSE code: IFX/OTCQX code: IFNNY), a global semiconductor leader in power systems and the Internet of Things, provides CoolGaN to UMEC (UMEC) ™ Power transistor, applied to its new 250 W network Power over Ethernet (PoE) adapter.
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40W Ultra-Compact DC-DC Converter for Space-Constrained Harsh Applications
2025-10-09
XP Power announced the launch of the cost-effective 40W DC-DC converter BCT40T series, which features the industry-leading 1 "x 1" (25.4mm x 25.4mm) compact package designed specifically for PCB installation. This new series offers high power density and comprehensive functionality, making it an ideal power solution for various demanding industrial technology, ITE, and communication applications where space is a key limiting factor.
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