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Vishay Introduces Automotive-Grade Optocouplers with Enhanced 800 V Isolation Rating for EV Batteries
2026-07-27
Recently, Vishay Intertechnology, Inc. (NYSE stock code: VSH) announced the launch of a new vehicle grade phototransistor optocoupler, VOLA617A, specifically designed for electric vehicles (EVs), including emerging 800 V battery architectures and high electrical isolation signal transmission for industrial automation systems.
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Samsung’s hybrid bonded HBM will be extended to 2029 and will debut alongside NVIDIA’s Feynman platform
2026-07-23
According to foreign media Wccftech, as high bandwidth memory (HBM) continues to evolve towards higher stack layers and higher bandwidth, the market generally believes that hybrid bonding is the key packaging technology for the next generation of HBM. However, according to industry reports in South Korea, Samsung may postpone the mass production of hybrid bonded HBM to 2029-2030 and synchronize it with Nvidia’s next-generation Feynman AI GPU platform.
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Domestic large model Kimi K3 can independently design AI chip: 45nm process with 100MHz frequency
2026-07-20
Since its release last night, the Kimi K3 model of the Dark Side of the Moon has gone viral both domestically and internationally. This 2.8 trillion parameter model’s performance has almost caught up with the top American AI, including GPT-5.6 and Fable 5.
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Sheng SIRUI announced the global launch of the STC42A automotive-grade hydrogen sensor, designed for battery thermal runaway detection
2026-07-16
Sensirion officially announced the full entry of its STC421A hydrogen sensor into the market. This product is an ideal choice for battery thermal runaway and hydrogen leak detection applications. STC421A is designed for automotive applications that require reliable hydrogen concentration measurement in clean air environments and is currently available for procurement through the global authorized channel partner network of Shengsirui.
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