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Littelfuse/C&K Introduces the TDB Series of Ultra-Compact Half-Pitch Surface-Mount DIP Switches
2026-04-27
Littelfuse Corporation (NASDAQ: LFUS), a leading company providing advanced solutions for safe and efficient power transmission, announced today the launch of Littelfuse/C&K ® The TDB series is an ultra small half pitch surface mount DIP switch series designed to support high-density PCB designs that require high space, reliability, and manufacturability.
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Kaixia releases PC OEM solid state drive EG7: based on BiCS8 QLC, the cost-effective choice
2026-04-23
Kioxia announced the launch of the new solid-state drive KIOXIA EG7 for PC OEMs. This is Kioxia’s first client storage solution based on BiCS8 QLC, which provides performance comparable to TLC product BG7, thereby reducing the TCO of PC products.
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Vishay’s new slim IHLP ® Inductance saves space and improves efficiency for commercial applications
2026-04-21
Recently, Vishay Intertechnology, Inc. (NYSE stock code: VSH) announced the launch of a new IHLP thin high current inductor, the IHLP1212-EZ-1Z, which adopts a compact 1212 package.
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Microchip与领先车载摄像头制造商舜宇智领达成战略合作 拓展全球ASA-ML生态系统
2026-04-16
Microchip Technology Inc. has always been committed to making innovative designs simpler through holistic system solutions. Today, it announced a strategic partnership with global car camera module supplier Sunny Zhiling (a subsidiary of Sunny Optical Technology Group) to jointly expand the automotive SerDes Alliance Mobility Link (ASA-ML) ecosystem.
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