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TDK launches compact double-sided vapor-deposited metallized polypropylene film capacitors for resonant topology applications
2025-08-07
TDK Corporation (TSE: 6762) is proud to announce the launch of its new B3264xH series of double-sided metallized metallized polypropylene (MMKP) film capacitors. This new series of components is specifically designed to handle pulse stresses of up to 6,500 V/µs in high-frequency applications, effectively addressing the limitations of traditional solutions
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Samsung plans to build an advanced packaging plant in the United States with an additional investment of 7 billion US dollars!
2025-07-31
According to the Korean Economic Daily (Hankyung), Samsung is preparing to invest an additional $7 billion in the United States to establish an advanced semiconductor packaging factory after reaching a $16.5 billion chip foundry contract with Tesla.
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Ansenmei and Schaeffler expand cooperation and launch a new plug-in hybrid vehicle platform based on EliteSiC
2025-07-28
Shanghai, China - July 28, 2025- Onsemi (NASDAQ: ON) announced the expansion of its partnership with leading drive technology company Schaeffler, adopting Onsemi’s next-generation silicon carbide MOSFET EliteSiC product line in a new design bid project. Anson’s solution will be integrated into Schaeffler’s main drive inverter for an advanced plug-in hybrid electric vehicle (PHEV) platform from a leading global automaker.
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Maoze launches Amphenol Wilcoxon 883M digital three-axis MEMS accelerometer for precise industrial condition monitoring and maintenance
2025-07-24
Mouser Electronics, a global authorized agent for introducing new electronic components and industrial automation products, is now selling Amphenol Wilcoxon’s 883M digital three-axis microelectromechanical systems (MEMS) accelerometer.
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