MediaTek releases Dimensity 8400 5G full core intelligent agent AI chip. The Dimensity 8400 inherits many advanced technologies from Dimensity’s flagship chip, and is the first to empower the high-end smartphone market with innovative full core architecture design, providing excellent generative AI performance and intelligent AI experience for high-end smartphones.

In order to accelerate the design of gallium nitride (GaN) power supplies (PSUs) with excellent energy efficiency and power density, STMicroelectronics has launched the EVL250WMG1L resonant converter reference design based on MasterGaN1L system in package (SiP).

Microchip Technology Inc. provides designers with a direct way to implement touch button functionality on the user interface. This low-power, water-resistant turnkey touch device integrates Microchip’s unified ecosystem, making the design process simpler and facilitating the transition between other turnkey solutions and MCU based touch implementations. MTCH2120 is the first product in the I2C based touch controller series, supporting a comprehensive design ecosystem.

Starting today, Maoze Electronics is selling Nordic Semiconductor’s nRF9151-DK development kit. NRF9151-DK is a pre certified single board development kit used for evaluating and developing Nordic nRF9151 System in Package (SiP) for LTE-M, NB IoT, GNSS, and DECT NR+applications, including asset tracking, smart metering, smart cities and agriculture, predictive maintenance, portable medical devices, and industrial 4.0/5.0.