News
News center
Anlite Company launched a 1.31μm semiconductor optical amplifier with high saturation output power and low noise
2026-08-03
Anritsu Corporation has been selling the 1.31 μ m semiconductor optical amplifier (SOA) AA3TB10EY since July 27th, aimed at meeting the growing demand for high saturation output power optical transceivers in data center interconnect (DCI) networks.
See more
Mouser Electronics is now selling Texas Instruments bq79716b-Q1 automotive-grade 16-cell battery monitor, which can accurately estimate the range of e
2026-07-30
Provide a wide range of semiconductor and electronic components ™ Mouser Electronics, a well-known new product introduction (NPI) agent in the industry, will start selling Texas Instruments bq79716b-Q1 automotive grade 16 cell battery monitor from today. The bq79716b-Q1 adopts advanced analog-to-digital converter (ADC) architecture and measurement system, which meets strict automotive standards and safety requirements. The bq79716b-Q1 battery monitor can provide accurate single cell voltage measurement for battery management systems (BMS) in electric vehicle (EV) applications.
See more
Vishay Introduces Automotive-Grade Optocouplers with Enhanced 800 V Isolation Rating for EV Batteries
2026-07-27
Recently, Vishay Intertechnology, Inc. (NYSE stock code: VSH) announced the launch of a new vehicle grade phototransistor optocoupler, VOLA617A, specifically designed for electric vehicles (EVs), including emerging 800 V battery architectures and high electrical isolation signal transmission for industrial automation systems.
See more
Samsung’s hybrid bonded HBM will be extended to 2029 and will debut alongside NVIDIA’s Feynman platform
2026-07-23
According to foreign media Wccftech, as high bandwidth memory (HBM) continues to evolve towards higher stack layers and higher bandwidth, the market generally believes that hybrid bonding is the key packaging technology for the next generation of HBM. However, according to industry reports in South Korea, Samsung may postpone the mass production of hybrid bonded HBM to 2029-2030 and synchronize it with Nvidia’s next-generation Feynman AI GPU platform.
See more