Microchip Technology Inc. has launched a revolutionary power management IC MCP16701, specializing in AI acceleration cards and edge server power pain points. This PMIC integrates 8 channels of 1.5A parallel buck converters (efficiency>95%), 4 channels of 300mA LDOs, and an intelligent MOSFET driver controller, which can achieve ± 1% voltage accuracy in the industrial temperature range of -40 ℃~125 ℃, providing a full link power solution for FPGA such as Xilinx Versal.

In the constantly evolving field of embedded systems, Infineon Technologies (FSE code: IFX/OTCQX code: IFNNY) will continue to provide developers with advanced microcontroller (MCU) solutions. Its AURIX ™、 TRAVEO ™ T2G and PSOC ™ Automotive and other MCU series meet various application needs with high performance, flexibility, and ease of use. To further support developers, Infineon has launched a new affordable development kit and a free integrated development environment (IDE), complemented by comprehensive software tools, tutorials, and a vast ecosystem.

TDK Corporation has further expanded the functionality of its Micronas HVC 5x embedded motor controller series in the automotive application field by launching the new HVC 5481G. HVC 5481G is a programmable Soc gate driver chip used to control an external power bridge with 6 N-channel FETs to drive various actuators, fans, and pumps* The HVC 5481G sample is now available on the market and is expected to begin mass production in 2026.

In the wave of restructuring the global semiconductor industry chain, domestic power chips are entering a critical stage from being "usable" to being "easy to use". Xinmao Microelectronics is based on the LLC technology architecture of "one chip, multiple capabilities", and provides a systematic solution to the domestic substitution problem in the field of medium and high-power power supplies through highly integrated design, flexible product combination, and full field adaptation capability. This article will deeply analyze how Xinmao Microelectronics promotes domestic chips from "substitution" to "first choice" through the "modular combination" strategy.