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Vishay ESD Protection Diodes Pass IEEE 10BASE-T1S Compliance Test
2026-05-18

VETH100A1DD1 complies with all three EMC testing specifications of OPEN Alliance for electrostatic protection devices

Recently, Vishay Intertechnology, Inc. (NYSE stock code: VSH) announced that its VETH100A1DD1 electrostatic protection diode, packaged in DFN1006, has successfully passed IEEE 10BASE-T1S compliance testing, confirming its suitability for automotive single pair Ethernet (OPEN) bus architecture.

VETH100A1DD1 complies with all three EMC testing specifications of OPEN Alliance for electrostatic protection devices and can support 10BASE-T1S, 100BASE-T1, and 1000BASE-T1 applications. In addition to the recently completed IEEE 10BASE-T1S compliance test, the device has also passed the compliance tests for 100BASE-T1 and 1000BASE-T1, and we can provide test reports upon request.

10BASE-T1S is an automotive data bus that can connect at least 8 nodes through a twisted pair cable of up to 25 meters in length. This standard uses a twisted pair cable to transmit data using baseband, with a nominal data rate of 10 Mbit/s, where "S" represents short-range operation. Unlike higher speed point-to-point automotive Ethernet links such as 100BASE-T1 and 1000BASE-T1, 10BASE-T1S adopts a multi-point bus topology, where multiple nodes share the same physical medium.

Each node of the 10BASE-T1S network can contain an electrostatic protection device, therefore, extremely low capacitance is crucial for maintaining signal integrity on the bus. VETH100A1DD1 is designed specifically to meet this requirement, with a capacitance below 1 pF as specified in the 10BASE-T1S testing specification, making it ideal for 10BASE-T1S applications and compatible with higher speed automotive Ethernet standards.

VETH100A1DD1 meets the 10BASE-T1S, 100BASE-T1, and 1000BASE-T1 standards, providing designers with various electrostatic protection solutions for automotive Ethernet architectures, including multi-point bus systems and higher speed point-to-point links.

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