Latest news: Intel announced the launch of the 12th generation Intel for the edge of the Internet of things ® CoRE ™ System on chip (SOC). As a new dedicated edge product series optimized for Internet of things applications, this pioneering slot system chip can provide high-performance integrated graphics and media processing functions for visual computing loads. In addition, thanks to the compact space occupation and the operational thermal design power consumption (TDP) suitable for wide temperature operation, it can also help customers achieve a smaller and innovative appearance and fanless heat dissipation design, and help them achieve the sustainability goal of their products.

Many people choose the number "seven" because of its "lucky" attribute, while unitedsic chooses it because the seven pins are very suitable for D2Pak semiconductor packaging. It has four more pins than the standard d2pak-3l version, which makes it unique. It is convenient for you to adopt flexible design choices, so as to improve the actual performance of SiC FET as much as possible. One pin is used for Kelvin connection to the source to avoid interaction between load current and gate drive, one pin is used for the gate, and the other five pins are connected in parallel to the source to minimize resistance and pin inductance.

Diodes (NASDAQ: diod) today announced the launch of a series of bi-directional current displays using a high stability zero drift architecture. These devices can accurately measure very low sensing voltages over a wide range of common mode voltages. The main product applications include notebook computers, battery chargers, industrial servo devices, servers, power racks and robot systems in server farms.

TDK launched the new EPCOS b72314s2 * series (Advanced S14 compact) lead chip varistors.