Mao Ze Electronics will now stock Molex’s four-row board-to-board connectors. These connectors adopt staggered circuit layout and 0.175mm pin pitch thin design, and have been patented, which can save 30% space compared with traditional connectors. They enable product developers and device manufacturers to support compact size more freely and flexibly, and are ideal for augmented reality/virtual reality (AR/VR), automotive, communications, the Internet of Things, medical and wearable applications.

TDK plans to launch the new EPCOS B33331I6 * series compact motor operating capacitor in September 2023

The ST-ONE series USB powered (USB-PD) digital controller with high integration and energy efficiency of ST-French Semiconductor adds a ST-ONEMP chip supporting dual charging ports.

Mouser Electronics will now stock Silicon Labs BG24 and MG24 Series 2 Wireless System on Chip (SoC) devices. This series of products is a low-power wireless SoC that supports 2.4GHz RF and is equipped with AI/ML hardware accelerator, which provides an ideal solution for the wireless connection of the Internet of Things (IoT) using Matter, OpenThread and Zigbee protocols. These new wireless SoC products support a variety of smart home, lighting and building automation applications, including gateways and hubs, sensors, location services and predictive maintenance.