In Asia, we have experienced weak demand, mainly due to improved lead times, and we have worked with customers to help them reduce inventory. I am proud of the continued success of the company’s Asian team in their work. The efforts they have made and the work they have completed not only ensure business continuity, but also continue to gain more market share for Ampelli in the region.

Ansemi (NASDAQ: ON), which is leading the way in intelligent power supply and intelligent sensing technology, has launched an ultra low power vehicle level wireless microcontroller using Bluetooth low-power connectivity. With the increase in the number of sensors and in vehicle communication, automotive manufacturers are increasingly inclined to use wireless connectivity technology to reduce wiring costs and weight, and NCV-RSL15 is an ideal choice. On the other hand, the increase in the number of sensor deployments may lead to an increase in the number of network attacks, exacerbating security issues. Using this new microcontroller can address these security concerns.

Diodes Corporation (Diodes) has launched a new DIODES PI3DBS16222Q to meet the demand for improved automotive computing capabilities and high-speed interface connectivity. This 4-channel differential exchange switch provides a highly efficient multitasking solution for automotive infotainment, telematics, SATA 3.0, SAS 3.0, and ADAS systems.

TDK Co., Ltd. introduces the new B82559A * A033 series shielded EPCOS ERU33 high current choke. The new series of components are installed through holes and have an ultra-high saturation current of 32 A to 83 A at 100 ° C. There are six models available, covering 3.2 μ H to 10 μ The range of inductance values for H, with a DC resistance as low as 0.85 m Ω or 1.2 m Ω, depends on the model. The choke coil uses a flat wire winding and is very compact in size, only 33 x 33 x 15 mm. By thermally connecting the flat wire winding and the magnetic core, a large area of ferrite surface can be coupled and connected to the heat sink, greatly improving the heat dissipation performance.