Industry news--Karmin Electronic (HK) Limited

Infineon launches new E-type XDP hybrid flyback controller IC for ultra-high power density design
2025-04-03

Following the launch of the industry's first PFC and hybrid flyback (HFB) combination IC, Infineon Technologies (FSE code: IFX/OTCQX code: IFNNY), a global semiconductor leader in power systems and the Internet of Things, has launched the E-type hybrid flyback controller series. A brand new XDP designed specifically for high-performance applications ™ The hybrid flyback digital controller series adopts an advanced asymmetric half bridge (AHB) topology structure, combining the simplicity of the flyback converter with the efficiency of the resonant converter to achieve high power density design. Therefore, this controller series is suitable for various AC/DC applications, including secondary markets and original chargers, adapters, power tools, electric bicycle chargers, industrial switch power supplies, television power supplies, LED drivers, etc.

XDP™ XDPS2221E DSO-14-66

Compared with active clamp flyback (ACF) and LLC resonant converters, hybrid flyback topology has many advantages. It reduces magnetic energy storage and operates with lower leakage inductance, enabling smaller transformer designs. Hybrid flyback (HFB) achieves high efficiency over a wide range of output voltages and reduces power loss through multi-mode operation. It not only reduces standby power consumption, but also improves efficiency under low load conditions to comply with the Energy Consistency Certificate (CoC) Level 2 and the US Department of Energy (DoE) Level 7 standards. These characteristics make HFB very suitable for designing compact and efficient power supplies.

Through patent pending PFC characteristic improvement technology, synchronous PFC and HFB start-up operations, and targeting the latest CoolGaN ™ The optimization measures for transistors and the E-type hybrid flyback IC have further improved the performance of power conversion applications. In addition, simplified parameter configuration, combined with comprehensive design tools and guidelines, provides strong support for efficiently implementing advanced designs.
The relevant information of this technology has been announced at the Infineon booth at the APEC 2025 conference in Atlanta, USA (March 16-20). The exhibits include an ultra compact 140 W GaN charger, a 120 W multi port charger solution with excellent standby performance and partial load efficiency, and an ultra-thin 400 W power supply device with a DC-DC voltage conversion efficiency of over 97%.

Click here to learn about the Infineon E-type XDP ™ More information about the hybrid flyback controller IC.

About Infineon

Infineon Technologies is a global semiconductor leader in the fields of power systems and the Internet of Things. Infineon drives the low-carbon and digital process with its products and solutions. The company has approximately 58060 employees worldwide (as of the end of September 2024) and generated revenue of approximately 15 billion euros in the fiscal year 2024 (as of September 30). Infineon is listed on the Frankfurt Stock Exchange (stock code: IFX）， Listed on the OTCQX international over-the-counter market in the United States (stock code: IFNNY）。

Infineon China

Infineon Technology Co., Ltd. officially entered the Chinese Mainland market in 1995. Since establishing its first enterprise in Wuxi in October 1995, Infineon's business has grown rapidly, with over 3000 employees in China, becoming an important driving force for Infineon's global business development. Infineon has established a complete industrial chain in China, covering production, sales, marketing, technical support, etc., and has carried out in-depth cooperation with leading domestic enterprises and universities in sales, technical application support, talent cultivation, and other aspects.

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