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MediaTek Releases Tianji 9300 Flagship 5G Generative AI Mobile Chip, Opening the Era of Full Core Computing
2023-11-08
MediaTek has released the flagship 5G generative AI mobile chip of the Tianji 9300. With its innovative full core architecture design, it provides far superior features such as high intelligence, high performance, high energy efficiency, and low power consumption. With groundbreaking advanced technology, it defines the flagship new experience in end-to-end generative AI, gaming, imaging, and other aspects.
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Aixin Yuanzhi Releases New Generation IPC SoC Chips AX630C and AX620Q
2023-10-30
AI vision chip research and development and basic computing power platform company Aixin Yuanzhi announced the release of the new generation of IPC SoC chip products AX630C and AX620Q, attracting attention with industry-leading high image quality, intelligent processing and analysis capabilities.
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Jiefa Technology Releases for High end Vehicle Class MCUAC7870x
2023-10-28
The 2023 4D New User Conference "Smart Entry New Path · Craft Core Born" Automotive Electronic Chip Theme Forum was successfully held in Shanghai. At the meeting, Jiefa Technology, a subsidiary of Four Dimensional New, announced the launch of the first multi-core high frequency MCU AC7870x that complies with functional safety ASIL-D based on the Arm Cortex R52 core. The release of AC7870x will officially launch Jiefa Technology’s layout in the field of high-end automotive standard MCU, and effectively promote the innovation and development of intelligent automotive electronic and electrical architecture, enhancing the competitiveness of independent automotive chips in the global automotive electronics market.
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Launch of Infineon MOTIX TLE989x MCU: Single chip power IC equipped with CAN (FD) interface, more suitable for automotive/BLDC motor control
2023-10-23
Starting from today, Infineon MOTIX will be available for sale ™ TLE989x microcontroller (MCU). The TLE989x series microcontroller extends its comprehensive and validated MOTIX ™ MCU embedded power IC product portfolio, with CAN (FD) as the communication interface. Compared to the TLE987x product series, this series has increased processing power by approximately 60%, while also having additional functional security and network security features such as secure startup and key storage. These MCUs integrate gate drivers, MCUs, communication interfaces, and power supplies on a single chip, occupying an extremely small board area, achieving excellent integration and system costs, suitable for various automobiles
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