In order to continue promoting the development of Universal Flash (1) (UFS) technology, the global leader of storage solutions, Armor Corporation, recently announced that the second generation UFS 4.0 embedded flash devices with higher performance have begun to be sampled (2). Provide fast embedded storage transmission speed in a small package size, suitable for various next-generation mobile applications. The improved performance of Armor UFS products enables these applications to leverage the advantages of 5G connectivity, thereby accelerating download speed, reducing latency, and improving user experience.

Bourns ® SRN8040HA is a brand new high-temperature inductor that can emit lower magnetic field radiation noise compared to unshielded inductors. At the same time, it is also a more cost-effective alternative to fully shielded ferrite inductors. SRN8040HA series supports high current capacity. The Saturation current Isat range is 1.3 – 15 A, and the temperature rise current Irms range is 1.0 – 10.0 A.

Diodes Corporation (Nasdaq: DIOD) has launched a series of new PCI Express that meet automotive specifications for the new generation of in car network applications ® (PCIe ®) 3.0 Technical Packet Switch. The architecture used by these products can support flexible port configurations, and can allocate uplink, downlink, and cross domain endpoint device (CDEP) ports as needed.

Nexperia, a high-capacity production expert in the field of basic semiconductor devices, announced the expansion of the NextPower 80/100 V MOSFET product portfolio’s packaging series. Previously, this product combination only provided LFPAK56E packaging, but now it has added LFPAK56 and LFPAK88 packaging designs. These devices have high efficiency and low peak characteristics, suitable for communication, server, industrial, switching power supply, fast charging, USB-PD, and motor control applications.