Recently, the media learned from the Anhui Provincial Key Laboratory of Quantum Computing Chips that China’s scientific research team has successfully developed the first generation of commercial grade semiconductor quantum chip circuit boards, which can support the packaging and testing needs of up to 6 bit semiconductor quantum chips, enabling semiconductor quantum chips to interact and connect with other key core components of quantum computers more efficiently, fully leveraging the powerful performance of semiconductor quantum chips.

Linghua Technology, the world’s leading edge computing solution provider and NVIDIA’s preferred partner, today released a highly innovative and highly anticipated ROSube RQX-59 series of products, specifically tailored for innovation in the fields of robots, AMR (autonomous mobile robots) and automatic driving.

Today, Samsung Electronics announced that it has started mass production of a new in car UFS 3.1 memory solution optimized for in car infotainment systems (IVI). This solution has the lowest power consumption of Samsung in car memory, which can help car manufacturers create an excellent travel experience for consumers.

TDK Corporation (Tokyo Stock Exchange code: 6762) introduced two new copper inner electrode piezoelectric actuators COM30S5 and COM45S5, which are made of Lead zirconate titanate (PZT) materials that meet RoHS requirements. The new components adopt TDK patented copper electrode based HAS (High Efficiency Stacking) technology, which is supplied as passive components in a shell free package, achieving good dynamic range, high force/volume ratio, and nanoscale accuracy. Compared to other technologies, TDK uses HAS technology for piezoelectric actuators with better performance, better humidity stability, and longer service life.