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The car’s intellectualization speeds up and Roma builds a high wall for safety
2022-09-17
A new round of global technological and industrial revolution is coming quietly. Electrification, networking, intelligence and sharing have become the development trend and trend of the automobile industry.
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Liquid level detection of dispensing machine with Turk capacitance sensor
2022-09-13
The principle of "faster, bigger and farther" is no longer applicable to all aspects of human and technological development. A typical example is electronic component developers, who are competing to install smaller and smaller components for equipment. The functions of many devices are constantly expanding, but they must not take up more space. Therefore, the circuit board must be installed with more closely arranged components. No matter in the field of medical technology or your smart phone, electronic components are moving towards miniaturization, which can only be achieved through appropriate manufacturing processes.
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Intel releases the first slot system chip for edge innovation to help customers unlock more new opportunities
2022-09-09
Latest news: Intel announced the launch of the 12th generation Intel for the edge of the Internet of things ® CoRE ™ System on chip (SOC). As a new dedicated edge product series optimized for Internet of things applications, this pioneering slot system chip can provide high-performance integrated graphics and media processing functions for visual computing loads. In addition, thanks to the compact space occupation and the operational thermal design power consumption (TDP) suitable for wide temperature operation, it can also help customers achieve a smaller and innovative appearance and fanless heat dissipation design, and help them achieve the sustainability goal of their products.
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Unitedsic launches seven new 750V SiC FETs with seven pin design
2022-09-07
Many people choose the number "seven" because of its "lucky" attribute, while unitedsic chooses it because the seven pins are very suitable for D2Pak semiconductor packaging. It has four more pins than the standard d2pak-3l version, which makes it unique. It is convenient for you to adopt flexible design choices, so as to improve the actual performance of SiC FET as much as possible. One pin is used for Kelvin connection to the source to avoid interaction between load current and gate drive, one pin is used for the gate, and the other five pins are connected in parallel to the source to minimize resistance and pin inductance.
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