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STMicroelectronics’ 250W MasterGaN reference design accelerates the realization of compact and efficient industrial power suppliesIn order to accelerate the design of gallium nitride (GaN) power supplies (PSUs) with excellent energy efficiency and power density, STMicroelectronics has launched the EVL250WMG1L resonant converter reference design based on MasterGaN1L system in package (SiP).
2024-12-23
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Microchip launches new turnkey capacitive touch controller product MTCH2120Microchip Technology Inc. provides designers with a direct way to implement touch button functionality on the user interface. This low-power, water-resistant turnkey touch device integrates Microchip’s unified ecosystem, making the design process simpler and facilitating the transition between other turnkey solutions and MCU based touch implementations. MTCH2120 is the first product in the I2C based touch controller series, supporting a comprehensive design ecosystem.
2024-12-21
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Maoze launches Nordic Semiconductor nRF9151-DK development kit for saleStarting today, Maoze Electronics is selling Nordic Semiconductor’s nRF9151-DK development kit. NRF9151-DK is a pre certified single board development kit used for evaluating and developing Nordic nRF9151 System in Package (SiP) for LTE-M, NB IoT, GNSS, and DECT NR+applications, including asset tracking, smart metering, smart cities and agriculture, predictive maintenance, portable medical devices, and industrial 4.0/5.0.
2024-12-17
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Nexperia launches miniature pinless logic IC to help save space and enhance reliability in automotive applicationsNexperia has released a series of new logic ICs using the micro car grade MicroPak XSON5 pinless package. These miniature logic ICs are designed for space limited applications and are suitable for various complex application scenarios in the automotive field, such as chassis safety systems, battery monitoring, infotainment systems, and advanced driver assistance systems (ADAS). The MicroPak XSON5 adopts a heat enhanced plastic housing, which reduces the PCB area by 75% compared to traditional pin based micro logic packaging. In addition, the package also features side wettable solder pads that support automatic optical inspection (AOI) of solder joints.
2024-12-11
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