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AI vision chip research and development and basic computing power platform company Aixin Yuanzhi announced the release of the new generation of IPC SoC chip products AX630C and AX620Q, attracting attention with industry-leading high image quality, intelligent processing and analysis capabilities.
The 2023 4D New User Conference "Smart Entry New Path · Craft Core Born" Automotive Electronic Chip Theme Forum was successfully held in Shanghai. At the meeting, Jiefa Technology, a subsidiary of Four Dimensional New, announced the launch of the first multi-core high frequency MCU AC7870x that complies with functional safety ASIL-D based on the Arm Cortex R52 core. The release of AC7870x will officially launch Jiefa Technology’s layout in the field of high-end automotive standard MCU, and effectively promote the innovation and development of intelligent automotive electronic and electrical architecture, enhancing the competitiveness of independent automotive chips in the global automotive electronics market.
Starting from today, Infineon MOTIX will be available for sale ™ TLE989x microcontroller (MCU). The TLE989x series microcontroller extends its comprehensive and validated MOTIX ™ MCU embedded power IC product portfolio, with CAN (FD) as the communication interface. Compared to the TLE987x product series, this series has increased processing power by approximately 60%, while also having additional functional security and network security features such as secure startup and key storage. These MCUs integrate gate drivers, MCUs, communication interfaces, and power supplies on a single chip, occupying an extremely small board area, achieving excellent integration and system costs, suitable for various automobiles
TDK Corporation has launched the high-performance EPCOS ERUC23 series components (B82559S *), expanding its SMD coupling inductor product portfolio. Coupling inductor refers to an inductor where two coils share a magnetic core. The ERUC23 series comes in six models to choose from, all using flat wire windings