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Transform, Inc. (Nasdaq: TGAN), a leading enterprise and global supplier of highly reliable and high-performance gallium nitride (GaN) power conversion products, announced the launch of its 1200V power transistor simulation model and initial specifications. TP120H070WS power transistor is the only 1200V GaN-on Apphire power semiconductor launched so far, leading similar products. The launch of this product shows that Transporm has the ability to support future automotive power systems, as well as three-phase power systems that have been widely used in the industrial, data communication and renewable energy markets.
Continuing to promote the development of Universal Flash Storage Technology (UFS), Kioxia Corporation is a leading global storage solution provider, announcing the launch of a new generation of high-performance UFS Ver. 4.0 embedded flash storage devices and has begun sample production. These devices come in small packages that provide fast built-in storage transfer speeds and are optimized for various next-generation mobile applications, including state-of-the-art smartphones.
Mao Ze Electronics will begin selling the LIS2DUX12 and LIS2DUXS12 AI enhanced intelligent accelerometers from STMicroelectronics today. These accelerometers use STMicroelectronics’ third-generation MEMS technology, which can accurately detect events and gestures with high accuracy and low power consumption. This new intelligent accelerometer supports a series of "always aware" applications, including wearable devices, game controllers, portable medical devices, asset trackers, and wireless sensor nodes.
Recently, Vishay Intertechnology, Inc. announced the launch of a new thick film power resistor - IOA, which has passed AEC-Q200 certification and is packaged in a small SOT-227 package, and can be directly installed on a heat sink. Vishay MCB ISOA has high pulse processing capability, with a power dissipation of up to 120 W at a bottom shell temperature of 85 ° C. It can be equipped with NTC thermistors for internal temperature monitoring, and pre coated with phase change thermal interface materials (PC-TIM) to improve mounting efficiency.