Italy France Semiconductor has launched multiple antenna matching RF integrated passive devices to comprehensively improve the RF performance of STM32
2023-03-09
Italy France Semiconductor released nine radio frequency integrated passive devices (RF IPDs) optimized for STM32WL wireless microcontroller (MCU). The new product is a monolithic integrated antenna impedance matching, balun and harmonic filter circuit.
STM32WL MCU of Italian French Semiconductor is a series of wireless dual-core microcontroller chips, Arm ® Cortex ®- The M4 processing core is responsible for processing application tasks, and the Cortex-M0+core is specialized in managing sub-GHz remote radio frequency communication functions, bringing application-level processing and wireless communication functions to intelligent Internet of Things devices. The RF module conforms to the LPWAN Internet of Things standard, supports multiple modulation methods, and is attached with LoRaWAN in the STM32CubeWL MCU software package ® And Sigfox ™ Protocol stack.
RF IPD is a microchip level packaging device connecting STM32WL MCU and antenna, which helps to maximize RF performance. Monolithic integration of all components can ensure the stability of RF performance and avoid the impact of manufacturing process fluctuations on the traditional matching circuit composed of discrete devices. RF IPD can also simplify circuit design, save material costs, and support more compact design. It is an ideal choice for cost-sensitive and space-constrained IoT devices.
The nine newly launched RF IPD products allow designers to choose the best parameters according to the RF frequency band and power, MCU package type and two or four layers of PCB. BALFHB-WL-01D3 to BALFHB-WL-06D3 are applicable to 868MHz and 915MHz wireless communication. BALFLB-WL-07D3, BALFLB-WL-08D3 and BALFLB-WL-09D3 are suitable for 490MHz wireless communication. Each product integrates a complete transceiver signal channel between MCU and antenna. The on-chip integrated filter can highly attenuate unwanted emission harmonics, helping designers meet the regulations formulated by the global radio licensing authority.
All new products have been put into production, using 2.13mm x 1.83mm 8-bump wafer level chip packaging, and the thickness after reflow soldering is less than 630 µ m.
About Italian and French semiconductors
Italy France Semiconductor has 50000 semiconductor technology creators and innovators, mastering the semiconductor supply chain and advanced manufacturing equipment. As a vertical integration manufacturer of semiconductors (IDM), Italian and French semiconductors, together with more than 200000 customers and thousands of partners, develop products and solutions, and jointly build an ecosystem to help them better cope with various challenges and new opportunities, and meet the world's higher demand for sustainable development. The technology of Italian and French semiconductors makes people's travel more intelligent, power and energy management more efficient, and the Internet of Things and interconnection technology are more widely used. Italy and France Semiconductor promised to achieve carbon neutrality by 2027. For details, please visit the website of Italy France Semiconductor Company: www.st.com
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