CoolSiC ™ 1200V SiC MOSFET low ohm products are packaged in to247 and built on the most advanced trench gate semiconductor technology. After optimization, the performance and reliability are further improved. Packaging is adopted XT interconnect technology, the latest coolsic ™ MOSFET has first-class heat dissipation performance.

Infineon Technology Co., Ltd. (FSE: IFX / otcqx: ifnny) launched cipos tiny im323-l6g 600 V 15 a new product to further expand its cipos ™ The product lineup of tiny intelligent power module (IPM) series. This new IPM uses trendstop ™ Rc-d2 IGBT power switching device and advanced SOI grid driving technology can maximize efficiency and achieve higher reliability, while minimizing overall size and reducing system cost. The integrated packaging of discrete power semiconductors and drivers enables designers to save time and energy in product design, so as to significantly speed up production

Nijmegen, July 29, 2021: Nexperia, an expert in the field of basic semiconductor devices, today announced the launch of nine new power bipolar transistors, expanding the product portfolio of DPAK package with thermal and electrical advantages, covering 2 a - 8 A and 45 V - 100 V applications. The new MJD series devices are pin compatible with other MJD devices packaged in DPAK, and have significant advantages in reliability.

TDK group (Tokyo Stock Exchange code: 6762) launched a new b3202 * H / J series EPCOS mkp-y2 thin film capacitor for interference suppression applications. Compared with the traditional model with the maximum operating temperature of 110 ° C, the maximum operating temperature of b3202 * H / J series reaches 125 ° C. The capacity range of the new series is 1NF to 1 µ F, the maximum rated voltage is 300V AC, and can maintain a stable capacity under severe working conditions. The capacitor can meet IEC 60384-14:2013 / amd1:2016 and aec-q200d standards.