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Samsung plans to build an advanced packaging plant in the United States with an additional investment of 7 billion US dollars!According to the Korean Economic Daily (Hankyung), Samsung is preparing to invest an additional $7 billion in the United States to establish an advanced semiconductor packaging factory after reaching a $16.5 billion chip foundry contract with Tesla.
2025-07-31
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Ansenmei and Schaeffler expand cooperation and launch a new plug-in hybrid vehicle platform based on EliteSiCShanghai, China - July 28, 2025- Onsemi (NASDAQ: ON) announced the expansion of its partnership with leading drive technology company Schaeffler, adopting Onsemi’s next-generation silicon carbide MOSFET EliteSiC product line in a new design bid project. Anson’s solution will be integrated into Schaeffler’s main drive inverter for an advanced plug-in hybrid electric vehicle (PHEV) platform from a leading global automaker.
2025-07-28
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Maoze launches Amphenol Wilcoxon 883M digital three-axis MEMS accelerometer for precise industrial condition monitoring and maintenanceMouser Electronics, a global authorized agent for introducing new electronic components and industrial automation products, is now selling Amphenol Wilcoxon’s 883M digital three-axis microelectromechanical systems (MEMS) accelerometer.
2025-07-24
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In the first half of this year, China opened up over 5.5 million pieces of training data for humanoid robotsAccording to CCTV News, at today’s press conference of the State Council Information Office, the relevant person in charge of the Ministry of Industry and Information Technology introduced that in the first half of this year, China’s innovative application achievements accelerated their landing, and the independently developed large amphibious firefighting aircraft AG600 was awarded the model qualification certificate and production license by the Civil Aviation Administration of China.
2025-07-21
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