Save 75% of PCB area and have side wettable solder pads, supporting optical inspection

Nexperia today released a series of new logic ICs using the micro car grade MicroPak XSON5 pinless package. These miniature logic ICs are designed for space limited applications and are suitable for various complex application scenarios in the automotive field, such as chassis safety systems, battery monitoring, infotainment systems, and advanced driver assistance systems (ADAS). The MicroPak XSON5 adopts a heat enhanced plastic housing, which reduces the PCB area by 75% compared to traditional pin based micro logic packaging. In addition, the package also features side wettable solder pads that support automatic optical inspection (AOI) of solder joints.
Nexperia launches miniature pinless logic IC to help save space and enhance reliability in automotive applications
This product release consolidates Nexperia's leading position in the logic device industry, with its innovative packaging technology meeting the growing demands of the automotive industry. The leadless package with side wettable solder pads supports the use of AOI technology to inspect solder joint quality, thereby improving production reliability and accelerating circuit board production speed. This not only helps to reduce costs, but also ensures that the solder joints are fully welded to meet strict standards.

Nexperia's SOT8065-1 MicroPak XSON5 has 5 pins and measures only 1.1mm x 0.85mm x 0.47mm, making it ideal for space constrained automotive applications. It does not have layering issues and has excellent moisture resistance, with a moisture resistance level of MSL-1. Both sides and the bottom of the solder pad are evenly covered with a 7mm tin layer, which can effectively prevent oxidation and comply with RoHS and "dark green" standards. SOT8065-1 can package chips with the same wafer size as SOT353, but it occupies a smaller PCB area and has excellent soldering durability and enhanced electrical performance.

In order to meet the growing demand for micro logic ICs in the automotive industry, Nexperia has launched 64 MicroPak XSON5 packaged devices that have obtained AEC-Q100 certification. [KC1]


About Nexperia

Nexperia is headquartered in the Netherlands and is a global semiconductor company with a rich and long history of development in Europe. Currently, it has over 14000 employees in Europe, Asia, and the United States. As a leader in the development and production of basic semiconductor devices, Nexperia's devices are widely used in various application fields such as automotive, industrial, mobile, and consumer, providing support for the basic functions of almost all commercial electronic designs in the world.

Nexperia provides services to global customers with an annual product shipment volume exceeding 100 billion units. These products have become industry benchmarks in terms of efficiency (such as process, size, power, and performance) and have gained widespread recognition. Nexperia has a rich IP product portfolio and continuously expanding product range, and has obtained certifications for IATF 16949, ISO 9001, ISO 14001, and ISO 45001 standards, fully demonstrating the company's firm commitment to innovation, efficiency, sustainable development, and meeting the stringent requirements of the industry.