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Valens will showcase video conferencing solutions on InfoComm 2023 to improve work efficiency in hybrid office spaces
2023-06-07

Valens Semiconductor (New York Stock Exchange code: VLN) is a leading supplier of high-speed connectivity solutions for the audiovisual and automotive markets. It recently announced that it will showcase its video conferencing solution at the 2023 InfoComm, which will drive the development of conference spaces and promote more inclusive and collaborative video conferencing settings to meet the needs of today's flexible workplaces. The InfoComm American Audiovisual Technology and System Integration Exhibition will be held from June 14th to June 16th at the Orlando National Convention and Exhibition Center in Orlando, Florida, USA. At that time, 80 audio and video manufacturers will showcase products embedded in Valens Semiconductor chipsets, including the release of more than ten products.

Gabi Shriki, Senior Vice President and Head of Audiovisual Business at Valens Semiconductor, stated: Today, there are still tens of millions of conference rooms that require high-speed audio and video devices to support mixed work modes and improve productivity within enterprises. Therefore, multi camera video conferencing applications are one of the fastest growing areas for audio and video devices, and Valens Semiconductor is in a favorable position for the rapidly growing demand in the video conferencing market. We are pleased to once again showcase technological advancements and new disruptive solutions for our customers Provide users with a reliable and stable connection foundation to help them develop innovative products. Our customers' new solutions and products launched on InfoComm 2023 demonstrate their confidence in our products Gabi Shriki added, "Our commitment to the market has been further demonstrated, and our upcoming professional USB 3.2 expansion chipset VS6320 will address the urgent need to expand many remote USB 3.2 peripherals, which are needed in video conferencing, industrial, and medical applications

Valens Semiconductor provides high-performance, cost-effective, and flexible connectivity solutions to address the most pressing connectivity challenges faced by the video conferencing industry, including the need to support multiple video cameras and video streams in various conference rooms from small to large, as well as connecting various video conferencing settings and devices (such as dedicated room PCs or built-in devices), No matter where the attendees are (face-to-face or remote video).

Valens Semiconductor will showcase the future oriented multi camera video solution VA7000, which made its debut at ISE 2023 and was named the "Meeting Equity Demo" by rAVe pubs as the best showcase. On InfoComm 2023, it will be presented in the form of a complete reference design, enabling customers to enter the market faster. The VA7000 chipset series has extended the uncompressed local camera serial interface (CSI-2), changed the design of video conferencing systems, simplified installation, and reduced overall system costs.

Welcome to InfoComm 2023 American Audiovisual Technology and System Integration Exhibition at the Orlando National Convention and Exhibition Center in Orlando, Florida, and visit Valens Semiconductor booth # 3043 to learn about its latest innovations in audio and video connectivity.

About Valens Semiconductor

Valens Semiconductor continuously breaks through its limits by enabling long-distance high-speed video and data transmission for the audiovisual and automotive industries. Valens HDBaseT ® Technology is at the forefront of the professional audio and video market, with tens of millions of Valens chips installed and shipped in thousands of HDBaseT capable products. Valens Automotive technology is a key driving force for the development of autonomous driving, and Valens chipsets have been installed in multiple cars at Mercedes Benz around the world. Valens is a key driver of the development of ADAS and autonomous driving technology, and its advanced technology is the foundation of a new industry standard for high-speed connectivity in automobiles.

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