Small chip ucie standard

Small chip ucie standard
2022-03-04

Yesterday, Intel, AMD, arm, Google cloud, meta, Microsoft, Qualcomm, Samsung and TSMC announced the establishment of a small chip interconnection standard ucie.

Ucie (universal chip interconnect express) will be an open small chip interconnection protocol, which will meet customers' requirements for customizable packaging.

It is reported that the founding company approved the ucie 1.0 specification, which aims to establish ubiquitous interconnection at the package level, using the mature PCI Express (PCIe) and compute Express link (CXL) industry standards.

This set of standards will make it possible for small chips from different manufacturers to communicate with each other and allow chips from different manufacturers to mix and match.

Uciantech will become the initial version of uciantech from Intel and will be released to the industry alliance today.

Intel said in its statement: "Integrating multiple small chips into one package to provide products across market segments is the future of the semiconductor industry and the pillar of Intel IDM 2.0 strategy. What is crucial to this future is an open small chip ecosystem. Major industry partners will work together under the ucie alliance to change the way the industry delivers new products and continue to deliver We are committed to a common goal. "

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