Infineon Technology Co., Ltd. (FSE: IFX / otcqx: ifnny) launched cipos tiny im323-l6g 600 V 15 a new product to further expand its cipos ™ The product lineup of tiny intelligent power module (IPM) series. This new IPM uses trendstop ™ Rc-d2 IGBT power switching device and advanced SOI grid driving technology can maximize efficiency and achieve higher reliability, while minimizing overall size and reducing system cost. The integrated packaging of discrete power semiconductors and drivers enables designers to save time and energy in product design, so as to significantly speed up production

Nijmegen, July 29, 2021: Nexperia, an expert in the field of basic semiconductor devices, today announced the launch of nine new power bipolar transistors, expanding the product portfolio of DPAK package with thermal and electrical advantages, covering 2 a - 8 A and 45 V - 100 V applications. The new MJD series devices are pin compatible with other MJD devices packaged in DPAK, and have significant advantages in reliability.

TDK group (Tokyo Stock Exchange code: 6762) launched a new b3202 * H / J series EPCOS mkp-y2 thin film capacitor for interference suppression applications. Compared with the traditional model with the maximum operating temperature of 110 ° C, the maximum operating temperature of b3202 * H / J series reaches 125 ° C. The capacity range of the new series is 1NF to 1 µ F, the maximum rated voltage is 300V AC, and can maintain a stable capacity under severe working conditions. The capacitor can meet IEC 60384-14:2013 / amd1:2016 and aec-q200d standards.

Semiconductor equipment manufacturers face daunting challenges in their efforts to distribute chips fairly to important industries such as automotive and medical treatment, but it is important to raise awareness of the chip shortage faced by SME OEMs. Due to the small demand of SMEs for the amount of chips, giving priority to chips for important semiconductor manufacturing tools will not require equipment manufacturers to change their distribution strategy, resulting in all-round victory - from SME OEMs and semiconductor equipment manufacturers to end market OEMs and end consumers.