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Infineon launches CoolGaN G3 transistor with new silicon package, promoting industry wide standardization processInfineon Technologies launches CoolGaN package using RQFN 5x6 ™ G3 100V (IGD015S10S1) and CoolGaN packaged with RQFN 3.3x3.3 ™ G3 80V (IGE033S08S1) high-performance GaN transistor.
2025-02-27
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Maoze Electronics and Amphenol jointly launch a new e-book exploring connectivity technology in electric vehicles and electric vertical takeoff and laA well-known New Product Introduction (NPI) agent dedicated to promoting industry innovation ™ Mouser Electronics announced a collaboration with Amphenol to launch a new e-book titled ’9 Experts Discuss the Role of Connectivity in e-Mobility’, which delves into the role of connectivity and sensor technology in electric vehicles. In the book, experts from the transportation industry and Amphenol provide in-depth insights into the technologies and strategies that support the unique needs of today’s pure electric/hybrid vehicles (EV/HEV) and electric vertical takeoff and landing (eVTOL) aircraft.
2025-02-24
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Ultra low static current! Nexperia LDO voltage regulator is suitable for multiple scenarios in automotive and industrial applicationsNexperia has recently launched a series of ultra-low static current universal low dropout (LDO) regulators that comply with the AEC-Q100 standard. This new series also includes high-precision LDO with output following, integrated output protection function, and a wide input voltage range, so it can be directly connected to car batteries.
2025-02-17
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RECOM launches RACPRO1-T series, a newly designed DIN rail power supplyRECOM has partnered with its recently acquired power expert LECO to launch a series of breakthrough cost advantages in three-phase DIN rail power supplies. The RACPRO1 series includes products with rated power of 240W, 480W, and 960W. Its ultra compact design leads similar products, with widths of only 43mm, 52mm, and 80mm, respectively. The design team has achieved excellent electrical efficiency through advanced thermal management technology, so there is no need to leave cooling space on both sides of the product, maximizing the overall system packaging density.
2025-02-15
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Karmin Electronic (HK) Limited
Shenzhen Kaiminghong Electronics Co., Ltd
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