Seven is an auspicious number. There are seven days in a week, seven wonders in the world, seven continents on the earth, seven brothers in Cucurbit babies, seven dwarfs in snow white

Many people choose the number "seven" because of its "lucky" attribute, while unitedsic chooses it because the seven pins are very suitable for D2Pak semiconductor packaging. It has four more pins than the standard d2pak-3l version, which makes it unique. It is convenient for you to adopt flexible design choices, so as to improve the actual performance of SiC FET as much as possible. One pin is used for Kelvin connection to the source to avoid interaction between load current and gate drive, one pin is used for the gate, and the other five pins are connected in parallel to the source to minimize resistance and pin inductance.

Of course, the "primary" properties of d2pak-7l are its small thickness and surface mounting, which makes it very suitable for installation in power intensive AC to DC products, DC to DC products and inverters with modern automatic assembly technology. In previous final product designs, pin devices packaged with TO-247 and other packages were often used, because they could conduct heat to essential external heat sinks and had the pin separation property for use under high voltage. However, this design also has disadvantages, it requires manual screwing of screws and nuts, and manual through-hole welding. Now, with the help of silver fired crystal grain connection and advanced wafer thinning technology, if unitedsic's new d2pak-7l package is installed on a PCB or liquid cooled isolation metal substrate, it will have outstanding thermal performance. In fact, because the loss of the fourth generation 750V SiC FET in these packages is very low, generally, only the PCB pad can provide sufficient heat dissipation, even in applications with very high power such as battery chargers and motors. The on resistances of the seven devices provided by unitedsic range from 60 milliohms to 9 milliohms, suitable for various applications and budgets. There are no competing devices, and the closest device is only 11 milliohms, as shown in the figure below.

The performance of d2pak-7l package is better than TO-247, and there is a better external space between the source and drain connections, which is more convenient for PCB layout and compliance with the leakage and gap requirements of the safety mechanism. The smaller package size can also reduce the length of the package bonding wire, which is an important advantage, because the RDS (on) and the volume of the grains are constantly shrinking. Because the wire junction is shorter and the loop caused by the length of the gull wing pin is smaller, the inductance will be reduced, thus reducing the voltage peak caused by the fast di / dt rate that may be brought about by the silicon carbide switching technology.

The d2pak-7l package introduced in the unitedsic 750V SiC FET series has opened the door to new cost-effective sensitive applications with its smaller shape, higher cost efficiency and lower loss. The low inductance, Kelvin gate connection and additional voltage margin provided by 750V rated products also improve the robustness of the device.

The library of unitedsic pictures online FET jet calculator contains d2pak-7l devices, so that you can choose the best device version for your application, and immediately read the efficiency, component loss and junction temperature rise of the selected conversion topology and cooling arrangement.

Therefore, whether seven is your lucky number or not, it represents a great progress in SiC FET packaging technology. Try it in your next power product design!