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英飞凌推出两款高效服务器电源解决方案，将AI数据中心电源模块（PSU）功率提升至30 kW
2026-06-11

Artificial intelligence workloads are redefining the power demand of modern data centers. The soaring GPU power levels and denser rack configurations are pushing server power infrastructure to its limits. To address these challenges, Infineon Technologies (FSE code: IFX/OTCQX code: IFNNY) has launched two system level solutions for server ODM and OEM manufacturers: one is an 18 kW three-phase power module (PSU) reference design optimized for a 50 V rack architecture; The other is a 30 kW three-phase interleaved T-shaped PFC evaluation board designed specifically for rack architecture of 800 VDC or ± 400 VDC power sidecars. Both of these solutions belong to Infineon's extensive AI server power supply product portfolio, aimed at helping customers shorten product time to market while achieving higher rack power, better efficiency, and superior heat dissipation performance.

Thanks to the optimized combination of Infineon components, the 18 kW PSU reference design achieved a peak efficiency of 97.5%

The 18 kW PSU reference design introduces an innovative integrated energy buffer concept that can smooth out load fluctuations at the grid end during AI load changes, eliminating the need for separate capacitor bank units. This high-efficiency energy storage method can reduce the volume of capacitors by 50%, while also lowering component costs and shrinking the size. The 30 kW PFC evaluation board utilizes Infineon's CoolGaN ™ Technology provides higher power density at lower system costs, which is highly attractive for data center operators who need to expand their infrastructure to meet the surging demand for AI computing.

Thanks to the optimized combination of Infineon components, including 650 V CoolSiC ™ MOSFET、80 V CoolGaN ™ Switch EiceDRIVER ™ Gate drive and PSOC ™ The 18 kW PSU reference design achieved a peak efficiency of 97.5% using a microcontroller. The power conversion core adopts a 5-level active neutral point clamp (ANPC) PFC topology structure, which can provide excellent efficiency throughout the full load range (especially from light load to medium load) and significantly reduce the volume of magnetic components. Compared with other topology structures, the peak efficiency of this scheme at 50% load is 0.2% higher than that of T-type PFC and 0.4% higher than that of Vienna rectifier.

In addition, the innovative integrated planar magnetic structure enables compact, modular, and scalable high-frequency transformer design. Its energy buffering circuit can ensure a holding time of 20ms and meet the stringent requirements of AI transient loads, supporting up to 180% EDPP loads. This reference design supports three-phase range input of 311-528 VAC, ensuring compatibility with global grid standards. The reliable heat dissipation design enables it to operate reliably within an ambient temperature range of -5 ° C to 45 ° C. This solution is compact in size, only 104 × 710 × 40 mm, and can perfectly fit into a standard 19 inch rack chassis, achieving an astonishing 100 W/in ³ power density.

The transverse tube of this 30 kW T-shaped PFC evaluation board uses 650 V CoolGaN ™ Bidirectional switch, vertical tube using 1200 V CoolSiC ™ MOSFET G2

The transverse tube of this 30 kW T-shaped PFC evaluation board uses 650 V CoolGaN ™ Bidirectional switch, vertical tube using 1200 V CoolSiC ™ MOSFET G2， Thus achieving a peak efficiency of over 99%. Through PSOC ™ The programmable power control accelerator (PPCA) integrated in the C3 MCU achieves precise current and voltage control with fast dynamic response. This design can maintain the input current total harmonic distortion (iTHD) at an extremely low level of less than 5% under loads of over 30%, and achieve a power factor of over 0.99 in the vast majority of operating load ranges.

Current detection by XENSIV ™ The TLE4978 isolated magnetic Hall+coil current sensor combines a bandwidth of 9 MHz, powerful common mode transient immunity (CMTI), and high precision, making it ideal for next-generation power supply designs based on SiC and GaN. This modular platform is designed to be integrated into the 1U full-size PSU form factor, primarily for HVDC data center applications. It can meet the requirements for precise voltage regulation and powerful heat dissipation performance under dynamic and demanding AI workloads.

Both designs have been optimized for Infineon's extensive AI server power supply product portfolio. Infineon's products cover the complete power supply chain from grid to core, including solid-state transformers (SST) and solid-state circuit breakers (SSCB), power supplies (PSU) and battery backup units (BBU), intermediate bus converters (IBC), and VRM power modules. By combining the complementary advantages of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN), Infineon provides customers with a clear and market validated end-to-end power architecture design path. This product portfolio also has ongoing design resource support, as well as scalable, high-quality components tailored specifically for the next generation AI server platform.

Supply situation

The 18 kW three-phase PSU reference design and the 30 kW three-phase T-shaped PFC evaluation board will both be open for trial/testing in the near future. For more information, please visit: here.

Infineon will participate in PCIM Europe 2026

The PCIM Europe exhibition for power electronics systems and components will be held in Nuremberg, Germany from June 9th to 11th, 2026. Infineon will showcase its low-carbon and digital products and solutions at booth 470 in Hall 7. For media inquiries, please send an email to media.relations@infineon.com If industry analysts would like to attend the briefing, please send an email to MarketResearch.Relations@infineon.com To learn more about Infineon's highlights at the PCIM 2026 exhibition, please visit www.infineon.com/pcim.

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