Microchip launches SAM9X75 hybrid microcontroller in SiP (System in Package) for automotive and electric vehicle human-machine interface (HMI) applications

Capable of MPU processing performance while supporting traditional MCU development environments

Designers in the automotive and electric mobility fields are constantly introducing human-machine interfaces (HMI) with advanced graphic effects to enhance user experience. To meet the growing demand for HMI solutions in the market, Microchip Technology Inc. today launched the SAM9X75D5M System in Package (SiP) product, which has passed AEC Q100 Level 2 certification. This product is equipped with Arm926EJ-S ™ Processor and 512Mb DDR2 SDRAM, supporting a maximum 10 inch display screen and 1024 × 768 pixel XGA resolution.  

SAM9X75D5M belongs to Microchip's hybrid microcontroller product series, which allows users to obtain advanced processing capabilities at the level of microprocessors (MPU) and higher density embedded memory while using traditional microcontroller development environments and supporting real-time operating system (RTOS) development. This device is tailor-made for automotive applications and is suitable for scenarios such as digital cockpit instruments, intelligent instruments for two - and three wheeled vehicles, HVAC control, and electric vehicle charging stations. The SAM9X75D5M integrates the microprocessor and memory into a single package, simplifying the development process. This device can provide sufficient cache space for automotive displays and support flexible display interfaces, including MIPI ® Display Serial Interface (DSI) ®）、 Low voltage differential signaling (LVDS) and parallel RGB data transmission.

The SAM9X75D5M adopts a simplified PCB layout, which can reduce wiring complexity, minimize the procurement risk of discrete DRAM chips, and support long-term supply and high reliability. As a hybrid microcontroller, its architecture design aims to achieve a balance between cost, performance, and power consumption, providing a path for traditional microcontrollers (MCUs) to migrate to microprocessors (MPUs) and meet higher performance and memory requirements.
By directly integrating DDR2 memory into the package, SAM9X75D5M can help designers avoid the long-standing price fluctuations and supply shortages in the discrete DDR memory market. This single-chip solution is more stable in terms of supply compared to discrete DDR memory, helping to eliminate the supply chain challenges associated with purchasing storage devices separately.

Rod Drake, Vice President of Microchip's Microprocessor Business Unit, stated, "The Microchip SAM9X75D5M redefines the standard for automotive grade solutions by integrating high-performance processors and memory into a single package, and bringing the advantages of System in Package (SiP) to the automotive market. One major advantage of system level packaging is that it can provide RAM buffer space far beyond traditional microcontroller solutions, and significantly reduce PCB area compared to discrete memory solutions, allowing designers to achieve complex designs in a compact space. ”

The SAM9X75D5M has rich advanced communication interfaces, including CAN FD, USB, and Gigabit Ethernet (GbE), while supporting Time Sensitive Network (TSN) protocol and integrating 2D graphics and audio functions.
In addition to the aforementioned devices, Microchip also offers various products that support HMI systems, including maXTouch ® Technology can achieve reliable touch detection in harsh environments or LCD screens with water, as well as power management and communication connection solutions.

Microchip offers a comprehensive portfolio of 32-bit hybrid microcontrollers and microprocessors, as well as ARM based products ® Compared to RISC V ® The 64 bit microprocessor architecture provides powerful and flexible choices for various applications ranging from consumer electronics to deep space exploration. The company's microprocessor products include single core and multi-core solutions, system modules (SOM), and system in package (SiP) solutions, which can help reduce design complexity, accelerate product launch, and simplify the supply chain. For more information on microprocessor products, please visit the official website.  
 
Development tools

SAM9X75D5M can be accessed through MPLAB ®  Developed using X Integrated Development Environment (IDE) and MPLAB Harmony software framework, supporting multiple real-time operating systems (RTOS), including FreeRTOS ®  With Eclipse ThreadX ®， Simultaneously supporting bare metal software development. Users can use Microchip Graphics Suite (MGS) or third-party graphics software tools such as Crack, LVGL, Altia ®  Develop high-quality graphical interfaces with Embedded Wizard. The SAM9X75 Curiosity LAN Development Kit (EV31H43A) is now available to assist designers in evaluating SAM9X75 SiP devices.
 
Supply and Pricing

The SAM9X75D5M SiP (device model SAM9X75D5M-V/4TBVAO) is now available on the market, with a minimum order quantity of 5000 pieces and a unit price of $9.12. Samples of 1 Gb and 2 Gb high-capacity storage devices for automotive applications are now available. Related devices support both RTOS and Linux simultaneously ® environment You can purchase and apply for high-capacity memory samples directly through Microchip, or contact sales representatives and authorized distributors worldwide.