Infineon launches a new industrial CoolSiC MOSFET 650 V G2 with TOLT and Thin-TOLL packaging, improving system power density
2024-06-14
Driven by technological progress and increasing attention to low-carbon, the electronics industry is transitioning towards more compact and powerful systems. Infineon Technologies Inc. (FSE code: IFX/OTCQX: IFNNY) is actively supporting and accelerating this trend with its Thin-TOLL 8x8 and TOLT packaging. These products can make greater use of PCB motherboards and daughter cards, while also taking into account the cooling requirements and space limitations of the system. Currently, Infineon is expanding its CoolSiC by adopting two new product lines, Thin-TOLL 8x8 and TOLT packaging ™ MOSFET discrete semiconductor device 650 V product portfolio. These two product lines are based on CoolSiC ™ The second-generation (G2) technology has significantly improved performance, reliability, and usability, specifically designed for mid to high end switch mode power supplies (SMPS) such as AI servers, renewable energy, electric vehicle chargers, and large household appliances.
CoolSiC? MOSFET 650 V G2 Combo 1-1
The Thin-TOLL package size of this series is 8x8 mm, and it has the leading on board thermal cycling (TCoB) capability among similar products in the market. TOLT package is a top cooling (TSC) package with a similar external dimensions to TOLL. Both types of encapsulation can bring many advantages to developers. For example, using these two packages in AI and server power units (PSUs) can reduce the thickness and length of daughter cards and allow for the use of flat heat sinks. Micro inverters, 5G PSUs, TV PSUs, and SMPS typically use convection cooling. When used in Thin-TOLL 8x8 packaging for these applications, it can greatly reduce the PCB area occupied by the power supply unit on the motherboard. At the same time, TOLT can also control the junction temperature of the equipment. In addition, TOLT devices also use Q-DPAK packaged CoolSiC with Infineon ™ 750 V top cooling CoolSiC ™ The combination of industrial products forms complementarity. When the required power supply for the device does not require Q-DPAK packaging, developers can use TOLT devices to reduce the PCB area occupied by SiC MOSFETs.
Supply situation
650 V G2 CoolSiC packaged with ThinTOLL 8x8 and TOLT ™ The current RDS (on) of MOSFET are 20, 40, 50, and 60 m Ω. The TOLT series also launched a model with an RDS (on) of 15 m Ω. By the end of 2024, more models of this product series will be launched. For more information, please visit www.Infineon. com/coolsic gen2.
About Infineon
Infineon Technologies Inc. is a global semiconductor leader in the fields of power systems and the Internet of Things. Infineon drives low-carbon and digital processes with its products and solutions. The company has approximately 58600 employees worldwide and had a revenue of approximately 16.3 billion euros in the fiscal year 2023 (as of September 30). Infineon is listed on the Frankfurt Stock Exchange (stock code: IFX) and on the OTC QX international over-the-counter trading market in the United States (stock code: IFNNY).
For more information, please visit www.infineon.com
For more news, please log in to Infineon News Center: https://www.infineon.com/cms/cn/about-infineon/press/market-news/
Karmin Electronic (HK) Limited 
Hong Kong Tel:852-39070580 96557277
Hong Kong Fax:852-39070581
Email：
Hong Kong address: Room 6, 11th floor, Huali industrial center, 10 - 14guidi street, Fo Tan, New Territories, Hong Kong