Industry news--Karmin Electronic (HK) Limited

Esailida has launched the XTOF time-of-flight (ToF) imaging chip and module, enabling high-speed 3D sensing under complex lighting conditions
2026-05-25

A new solution provides high-performance distance measurement capabilities for industrial, robotic, and LiDAR applications

Excelitas ® Recently announced the launch of a brand new XTOF ™ Series Time of Flight (ToF) Imaging Chips and XTOF-M ™ Series of miniature camera modules. These solutions are designed specifically for high-speed, high-precision optical distance measurement and object detection, enabling reliable 3D sensing capabilities in both indoor environments and full daylight conditions.

The XTOF series is a highly integrated single-chip CMOS ToF imager that uses a compact chip level package (CSP); With advanced 3D ToF technology, this series of products can provide high-speed operation performance and accurate distance measurement function. As a supplement to chips, the XTOF-M series integrates imagers, lighting systems, and control functions into compact camera modules, providing a plug and play solution for a wide range of application scenarios.

Achieving accurate and reliable 3D sensing under dynamic lighting conditions has always been a key challenge in industrial and outdoor applications, "said Richard Simons, project director of Esseida Photon Detection." Our XTOF solution perfectly combines high-speed operating performance with advanced ambient light suppression technology, allowing users to achieve accurate distance measurement even in full sunlight. This opens up more possibilities for automation, robotics technology, and LiDAR based system applications. ”

The XTOF series has a working distance of up to 240 meters, a compact package size of 2.8 x 2.8 millimeters, and a frame rate of up to 4000 ToF measurements per second. Its unique architecture design has extremely strong environmental light tolerance, and its sensing performance even approaches the theoretical limit of shot noise in harsh application environments, ensuring highly accurate measurements.

The XTOF-M series is further upgraded on the basis of the high-performance chips mentioned above, adopting a micro 3D camera module design that integrates lighting and sensing functions. It has low power consumption characteristics, an ambient light tolerance of up to 100 kLux, and provides calibrated and compensated outputs as well as a high-speed UART serial interface. Overall, these features not only simplify the system integration process, but also ensure consistent and stable performance under various operating conditions.

The new XTOF solution is highly suitable for applications such as industrial automation, robotics technology, and outdoor LiDAR systems; In these fields, equipment needs to maintain reliable operation in environments with varying lighting conditions. It has the ability to work efficiently in indoor and full daylight environments, and also supports continuous and stable operation of the system in both daytime and nighttime scenarios.

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