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TDK introduces a new b8272* series EPCOS SMT common mode choke.
Shanghai, China - Toshiba electronic components and memory Co., Ltd. ("Toshiba") today announced that it has started mass production of 21 new microcontrollers of m3h group, which is TXZ+ ™ Family advanced series, a new member of, manufactured by 40nm process. M3h group built-in arm ® Cortex ®- M3 core, running at 120mhz, can integrate 512KB code flash memory and 32KB data flash memory at most, with a write cycle life of 100000 times. In addition, the new microcontroller also provides a wealth of interfaces and motor control options, such as UART, I2C encoder and programmable motor control. M3h devices are widely used in many applications including motors, household appliances and industrial equipment.
CoolSiC ™ 1200V SiC MOSFET low ohm products are packaged in to247 and built on the most advanced trench gate semiconductor technology. After optimization, the performance and reliability are further improved. Packaging is adopted XT interconnect technology, the latest coolsic ™ MOSFET has first-class heat dissipation performance.
Infineon Technology Co., Ltd. (FSE: IFX / otcqx: ifnny) launched cipos tiny im323-l6g 600 V 15 a new product to further expand its cipos ™ The product lineup of tiny intelligent power module (IPM) series. This new IPM uses trendstop ™ Rc-d2 IGBT power switching device and advanced SOI grid driving technology can maximize efficiency and achieve higher reliability, while minimizing overall size and reducing system cost. The integrated packaging of discrete power semiconductors and drivers enables designers to save time and energy in product design, so as to significantly speed up production